- Bond or seal electronics circuits (metal)
Because it is non-corrosive, this material is ideal for use on metal, for encapsulating small circuits on connectors. After cure, will withstand -55° to 200 °C. No mixing required.
Curing Time: 72 hours at 25ºC
Shipping Weight: 1 lb. (0.5 kg)
S.M. Nour, J.R. Lawrence, H.Zhu, G.D.W. Swerhone, M. Welsh,T.W. Welacky, E. Topp "Bacteria Associated with Cysts of the Soybean Cyst Nematode (Heterodera glycines)" Applied and Environment Microbiology 69. 2003: 607-615