ADHESIVES
FOR DETAILS ON APPLICATION AND CURING
Electrically Conductive Silver Epoxy Two-component silver-filled epoxy for electrical connections which cannot be soldered, such as Ag/AgCl pellets. Pure silver is dispersed in both resin and hardener. Provides superior bonding. Cures in 15 minutes at 120 °C. Mix ratio 1:1. May be premixed and frozen for later use.
4898 Silver Epoxy (1 oz.) MSDS

Electrically Conductive Carbon Epoxy Two-component carbon-epoxy, curable at room and elevated temperatures. Ideal for electrostatic discharge protection and EMI/RFI shielding. 1:1 mix ratio. May be premixed and frozen for later use.
7335 Carbon Epoxy (2 oz.) MSDS

Sylgard A two-part silicone elastomer, ideal for potting and encapsulating applications. Very low dielectric constant sealing compound used in patch clamping and many other lab applications. After cure, will withstand -55° to 200 °C.
SYLG184 Sylgard
MSDS SylGard 184 Base

MSDS SylGard 184 Curing Agent

 

Silicone RTV adhesive  °C. No mixing required. A handy, general purpose laboratory sealant.
1571 RTV Sealant (4.7 oz.)

MSDS DOW 732 Sealant RTV

Silicone RTV adhesive (non-acidic) Because it is non-corrosive, this material is ideal for use on metal, for encapsulating small circuits on connectors. After cure, will withstand -55° to 200 °C. No mixing required.
7128 RTV Coating (3 oz.)

MSDS DOW 3140 RTV


13316 Mini Glue Gun

Comes with three sticks of special formula hot melt glue. UL approved. 110V 60 Hz only.
13316 Mini Glue Gun MSDS MSDS 725 Hot Melt Glue

DETAILS ON APPLICATION AND CURING